Low Voiding

Excellent Print Transfer Efficiencies

Eliminates HiP Defects

REACH and RoHS* Compliant

Powerful Wetting on All Surface Finishes

Print Speeds up to 200mm/sec

 2.DEscriptION

NCH88 no clean solder paste provides Class III performance to the value minded customers. NCH88 provides stable transfer efficiencies required to ensure long print life in all production environments. NCH88 performance ensures high operator satisfaction while reducing DPMO on the most challenging applications. NCH88 innovative activator chemistry provides powerful, durable wetting action accommodating a wide range of profiling processes and equipment. NCH88 will reduce wetting related defects such as HiP (head-in-pillow) and always provides smooth shiny joints. NCH88 has shown reduced BGA and BTC voiding to as low as <5% on BGA and <10% on BTC ground pads.

3. CLEANING

Pre-Reflow: AIM DJAW-10 effectively removes NCH88 solder paste from stencils while in process. DJAW-10 can be hand applied or used in under stencil wipe equipment. DJAW-10 will not dry NCH88 and will enhance transfer properties. Do not over-apply DJAW-10. Do not apply DJAW-10 to stencil topside. Isopropanol (IPA) is not recommended in process, but may be used as a final stencil rinse.

Post-Reflow Flux Residue: NCH88 residues can remain on the assembly after reflow and do not require cleaning. Where cleaning is mandated, AIM has worked closely with industry partners to ensure that NCH88 residues can be effectively removed with common defluxing agents. Contact AIM for cleaning compatibility information