Indium Corporation was presented with the Global Technology Award for its BiAgX® solder paste at SMTA International in Rosemont, Ill. on Tuesday, September 30.
Sponsored by Global SMT & Packaging, the Global Technology Awards have acknowledged outstanding innovations in the printed circuit board assembly and packaging industry for the past 10 years.
Global SMT & Packaging Editor-in-Chief Trevor Galbraith presents the Global Technology Award to Indium Corporation Director of Marketing Communications Rick Short.
BiAgX® was created specifically for high-temperature die-attach applications in discrete power devices. Designed as a dro-in replacement for standard high Pb-containing solder pastes, it has passed MSL1, HAST, and thermal cycle testing at several power semiconductor customers.
BiAgX® is suited for small, low-voltage QFN packages that are used in portable electronics, such as smartphones and tablets, automotive assemblies, and industrial applications. BiAgX® excels in high junction-temperature environments in excess of 150°C. It requires minimal process adjustments and no extra capital expenditure for customers converting from a standard high Pb-containing solder paste-based die-attach process.
BiAgX® addresses both customer demands and legislative changes that eliminate lead from high-melting die-attach applications. It is both Pb-free and Sb-free and does not contain costly specialty materials, such as nanosilver or sintering aids.
BiAgX® reflows, solders, wets, and solidifies just like any other solder paste, and is available in both dispensing and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes.
For more information about BiAgX®, visit www.indium.com/biagx, or email amackie@indium.com.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.
Sponsored by Global SMT & Packaging, the Global Technology Awards have acknowledged outstanding innovations in the printed circuit board assembly and packaging industry for the past 10 years.
Global SMT & Packaging Editor-in-Chief Trevor Galbraith presents the Global Technology Award to Indium Corporation Director of Marketing Communications Rick Short.
BiAgX® was created specifically for high-temperature die-attach applications in discrete power devices. Designed as a dro-in replacement for standard high Pb-containing solder pastes, it has passed MSL1, HAST, and thermal cycle testing at several power semiconductor customers.
BiAgX® is suited for small, low-voltage QFN packages that are used in portable electronics, such as smartphones and tablets, automotive assemblies, and industrial applications. BiAgX® excels in high junction-temperature environments in excess of 150°C. It requires minimal process adjustments and no extra capital expenditure for customers converting from a standard high Pb-containing solder paste-based die-attach process.
BiAgX® addresses both customer demands and legislative changes that eliminate lead from high-melting die-attach applications. It is both Pb-free and Sb-free and does not contain costly specialty materials, such as nanosilver or sintering aids.
BiAgX® reflows, solders, wets, and solidifies just like any other solder paste, and is available in both dispensing and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes.
For more information about BiAgX®, visit www.indium.com/biagx, or email amackie@indium.com.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.
